| Material | Molybdenum Copper | |
| Specification | Customers’ request: rod/sheet/special shape | |
| Density | Mo85Cu15 | >=10.0g/cm3 |
| Mo80Cu20 | >=9.9g/cm3 | |
| Mo70Cu30 | >=9.8g/cm3 | |
| Mo60Cu40 | >=9.66g/cm3 | |
| Mo50Cu50 | >=9.54g/cm3 | |
| Surface | Machined surface | |
Spaceflight fields,high temperature part of rockets and missiles, integrated circuit, heat sink and thermal sink or other microelectronic material.
1.Power amplifier heat spreader material
2.Radio base station in telecommunications
3.Electrode used in Electrode resistance welding electrodes
4.Electronic packaging materials and heat sink materials
5.Lead frame with high performance
6.IGBT modules for electric vehicle motors(EV/HEV)
7.Thermal control plates in military and civilian
Chemical Composition:| brand | Molybdenum contentWt% | Copper contentWt% | The density ofg/cm3 | Conductivity of heatW/(M.K) | Coefficient of thermal expansion(10-6/K) |
| Mo85Cu15 | 85± 1 | Balance | 10 | 160 - 180 | 6.8 |
| Mo80Cu20 | 80 ± 1 | Balance | 9.9 | 170 - 190 | 7.7 |
| Mo70Cu30 | 70 ± 1 | Balance | 9.8 | 180 - 200 | 9.1 |
| Mo60Cu40 | 60 ± 1 | Balance | 9.66 | 210 - 250 | 10.3 |
| Mo50Cu50 | 50 ±0.2 | Balance | 9.54 | 230 - 270 | 11.5 |
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